Air Spacer and Method of Forming Same

ABSTRACT

In an embodiment, a method of forming a semiconductor device includes forming a dummy gate stack over a substrate; forming a first spacer layer over the dummy gate stack; oxidizing a surface of the first spacer layer to form a sacrificial liner; forming one or more second spacer layers over the sacrificial liner; forming a third spacer layer over the one or more second spacer layers; forming an inter-layer dielectric (ILD) layer over the third spacer layer; etching at least a portion of the one or more second spacer layers to form an air gap, the air gap being interposed between the third spacer layer and the first spacer layer; and forming a refill layer to fill an upper portion of the air gap.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as, for example, personal computers, cell phones, digital cameras,and other electronic equipment. Semiconductor devices are typicallyfabricated by sequentially depositing insulating or dielectric layers,conductive layers, and semiconductor layers of material over asemiconductor substrate, and patterning the various material layersusing lithography to form circuit components and elements thereon.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallow more components to be integrated into a given area.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates an example of a Fin field-effect transistor (FinFET)in a three-dimensional view of an intermediate stage, in accordance withsome embodiments.

FIGS. 2, 3, 4, 5, 6, 7, 8A, 8B, 8C, 8D, 9A, 9B, 9C, 9D, 10A, 10B, 10C,10D, 11A, 11B, 11C, 11D, 12A, 12B, 12C, 12D, 13A, 13B, 13C, 13D, 14A,14B, 14C, 14D, 15A, 15B, 15C, 15D, 16A, 16B, 16C, 16D, 17A, 17B, 17C,17D, 18A, 18B, 18C, 18D, 19A, 19B, 19C, 19D, 20A, 20B, 20C, 20D, 21A,21B, 21C, 21D, 21E, 22A, 22B, 22C, 22D, 23A, 23B, 23C, 23D, 24A, 24B,24C, 24D, and 24E are cross-sectional views of intermediate stages inthe manufacturing of FinFETs, in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Embodiments will now be described with respect to particular examplesincluding integrated circuits comprising transistors, such as Finfield-effect transistor (FinFET) devices. However, embodiments are notlimited to the examples provided herein, and embodiments may beimplemented in a wide array of applications. As discussed in greaterdetail below, spacers may be formed adjacent to the gate electrode of aFinFET device to provide insulation and improve the performance of thedevice. The spacers may be subsequently removed, thereby replacing thespacers with air spacers or air gaps to provide better insulation than adeposited material layer.

FIG. 1 illustrates an example of an intermediate stage in the formationof a FinFET in a three-dimensional view, in accordance with someembodiments. The FinFET comprises a fin 52 on a substrate 50 (e.g., asemiconductor substrate). Isolation regions 56 are disposed in thesubstrate 50, and the fin 52 protrudes above and from betweenneighboring isolation regions 56. Although the isolation regions 56 aredescribed/illustrated as being separate from the substrate 50, as usedherein the term “substrate” may be used to refer to just thesemiconductor substrate or a semiconductor substrate inclusive ofisolation regions. Additionally, although the fin 52 is illustrated as asingle, continuous material as the substrate 50, the fin 52 and/or thesubstrate 50 may comprise a single material or a plurality of materials.In this context, the fin 52 refers to the portion extending between andprotruding above the neighboring isolation regions 56.

A dummy dielectric 66 is along sidewalls and over a top surface of thefin 52, and a dummy gate 68 and a mask 70 are over the dummy dielectric66. Collectively, the dummy dielectric 66, the dummy gate 68, and themask 70 form a dummy gate stack 72. Source/drain regions 96 are disposedin opposite sides of the fin 52 with respect to the dummy dielectric 66and dummy gate 68. FIG. 1 further illustrates reference cross-sectionsthat are used in later figures. Cross-section A-A is along alongitudinal axis of the dummy gate 68 and in a direction, for example,perpendicular to the direction of current flow between the source/drainregions 96 of the FinFET. Cross-section B-B is parallel to cross-sectionA-A and extends through a source/drain region of the FinFET.Cross-section C-C is perpendicular to cross-sections A-A and B-B and isalong a longitudinal axis of the fin 52 and in a direction of, forexample, a current flow between the source/drain regions 96 of theFinFET. Cross-section D-D is parallel to cross-section C-C and extendsthrough a shallow trench isolation (STI) region and perpendicularlythrough the longitudinal axis of the dummy gate 68 of the FinFET.Subsequent figures refer to these reference cross-sections for clarity.

Some embodiments discussed herein are discussed in the context ofFinFETs formed using a gate-last process. In other embodiments, agate-first process may be used. Also, some embodiments contemplateaspects used in planar devices, such as planar FETs, nanostructure(e.g., nanosheet, nanowire, gate-all-around, or the like) field effecttransistors (NSFETs), or the like.

FIGS. 2 through 24D are cross-sectional views of intermediate stages inthe manufacturing of FinFETs, in accordance with some embodiments. FIGS.2 through 7 and FIGS. 8A, 9A, 10A, 11A, 12A, 13A, 14A, 15A, 16A, 17A,18A, 19A, 20A, 21A, 22A, 23A, and 24A illustrate reference cross-sectionA-A illustrated in FIG. 1, except for multiple fins/FinFETs. FIGS. 8B,9B, 10B, 11B, 12B, 13B, 14B, 15B, 16B, 17B, 18B, 19B, 20B, 21B, 22B,23B, and 24B illustrate reference cross-section B-B illustrated in FIG.1, except for multiple fins/FinFETs. FIGS. 8C, 9C, 10C, 11C, 12C, 13C,14C, 15C, 16C, 17C, 18C, 19C, 20C, 21C, 22C, 23C, and 24C illustratereference cross-section C-C illustrated in FIG. 1, except for multiplefins/FinFETs. FIGS. 8D, 9D, 10D, 11D, 12D, 13D, 14D, 15D, 16D, 17D, 18D,19D, 20D, 21D, 22D, 23D, and 24D illustrate reference cross-section D-Dillustrated in FIG. 1, except for multiple fins/FinFETs. FIGS. 21E and24E illustrate reference cross-section E-E illustrated in FIGS. 21B and24B, respectively.

In FIG. 2, a substrate 50 is provided. The substrate 50 may be asemiconductor substrate, such as a bulk semiconductor, asemiconductor-on-insulator (SOI) substrate, or the like, which may bedoped (e.g., with a p-type or an n-type dopant) or undoped. Thesubstrate 50 may be a wafer, such as a silicon wafer. Generally, an SOIsubstrate is a layer of a semiconductor material formed on an insulatorlayer. The insulator layer may be, for example, a buried oxide (BOX)layer, a silicon oxide layer, or the like. The insulator layer isprovided on a substrate, typically a silicon or glass substrate. Othersubstrates, such as a multi-layered or gradient substrate may also beused. In some embodiments, the semiconductor material of the substrate50 may include silicon; germanium; a compound semiconductor includingsilicon carbide, gallium arsenide, gallium phosphide, indium phosphide,indium arsenide, and/or indium antimonide; an alloy semiconductorincluding silicon-germanium, gallium arsenide phosphide, aluminum indiumarsenide, aluminum gallium arsenide, gallium indium arsenide, galliumindium phosphide, and/or gallium indium arsenide phosphide; orcombinations thereof.

The substrate 50 has an n-type region 50N and a p-type region 50P. Then-type region 50N can be for forming n-type devices, such as NMOStransistors, e.g., n-type FinFETs. The p-type region 50P can be forforming p-type devices, such as PMOS transistors, e.g., p-type FinFETs.The n-type region 50N may be physically separated from the p-type region50P (as illustrated by divider 51), and any number of device features(e.g., other active devices, doped regions, isolation structures, etc.)may be disposed between the n-type region 50N and the p-type region 50P.

In FIG. 3, fins 52 are formed in the substrate 50. The fins 52 aresemiconductor strips. In some embodiments, the fins 52 may be formed inthe substrate 50 by etching trenches in the substrate 50. The etchingmay be any acceptable etch process, such as a reactive ion etch (RIE),neutral beam etch (NBE), the like, or a combination thereof. The etchmay be anisotropic.

The fins may be patterned by any suitable method. For example, the fins52 may be patterned using one or more photolithography processes,including double-patterning or multi-patterning processes. Generally,double-patterning or multi-patterning processes combine photolithographyand self-aligned processes, allowing patterns to be created that have,for example, pitches smaller than what is otherwise obtainable using asingle, direct photolithography process. For example, in one embodiment,a sacrificial layer is formed over a substrate and patterned using aphotolithography process. Spacers are formed alongside the patternedsacrificial layer using a self-aligned process. The sacrificial layer isthen removed, and the remaining spacers may then be used to pattern thefins. In some embodiments, the mask (or other layer) may remain on thefins 52.

In FIG. 4, an insulation material 54 is formed over the substrate 50 andbetween neighboring fins 52. The insulation material 54 may be an oxide,such as silicon oxide, a nitride, the like, or a combination thereof,and may be formed by a high density plasma chemical vapor deposition(HDP-CVD), a flowable CVD (FCVD) (e.g., a CVD-based material depositionin a remote plasma system and post curing to make it convert to anothermaterial, such as an oxide), the like, or a combination thereof. Otherinsulation materials formed by any acceptable process may be used. Inthe illustrated embodiment, the insulation material 54 is silicon oxideformed by a FCVD process. An anneal process may be performed once theinsulation material is formed. In an embodiment, the insulation material54 is formed such that excess insulation material 54 covers the fins 52.Although the insulation material 54 is illustrated as a single layer,some embodiments may utilize multiple layers. For example, in someembodiments a liner (not shown) may first be formed along a surface ofthe substrate 50 and the fins 52. Thereafter, a fill material, such asthose discussed above may be formed over the liner.

In FIG. 5, a removal process is applied to the insulation material 54 toremove excess insulation material 54 over the fins 52. In someembodiments, a planarization process such as a chemical mechanicalpolish (CMP), an etch-back process, combinations thereof, or the likemay be utilized. The planarization process exposes the fins 52 such thattop surfaces of the fins 52 and the insulation material 54 are levelafter the planarization process is complete. In embodiments in which amask remains on the fins 52, the planarization process may expose themask or remove the mask such that top surfaces of the mask or the fins52, respectively, and the insulation material 54 are level after theplanarization process is complete.

In FIG. 6, the insulation material 54 is recessed to form Shallow TrenchIsolation (STI) regions 56. The insulation material 54 is recessed suchthat upper portions of fins 52 in the n-type region 50N and in thep-type region 50P protrude from between neighboring STI regions 56.Further, the top surfaces of the STI regions 56 may have a flat surfaceas illustrated, a convex surface, a concave surface (such as dishing),or a combination thereof. The top surfaces of the STI regions 56 may beformed flat, convex, and/or concave by an appropriate etch. The STIregions 56 may be recessed using an acceptable etching process, such asone that is selective to the material of the insulation material 54(e.g., etches the material of the insulation material 54 at a fasterrate than the material of the fins 52). For example, an oxide removalusing, for example, dilute hydrofluoric (dHF) acid may be used.

The process described with respect to FIGS. 2 through 6 is just oneexample of how the fins 52 may be formed. In some embodiments, the finsmay be formed by an epitaxial growth process. For example, a dielectriclayer can be formed over a top surface of the substrate 50, and trenchescan be etched through the dielectric layer to expose the underlyingsubstrate 50. Homoepitaxial structures can be epitaxially grown in thetrenches, and the dielectric layer can be recessed such that thehomoepitaxial structures protrude from the dielectric layer to formfins. Additionally, in some embodiments, heteroepitaxial structures canbe used for the fins 52. For example, the fins 52 in FIG. 5 can berecessed, and a material different from the fins 52 may be epitaxiallygrown over the recessed fins 52. In such embodiments, the fins 52comprise the recessed material as well as the epitaxially grown materialdisposed over the recessed material. In an even further embodiment, adielectric layer can be formed over a top surface of the substrate 50,and trenches can be etched through the dielectric layer. Heteroepitaxialstructures can then be epitaxially grown in the trenches using amaterial different from the substrate 50, and the dielectric layer canbe recessed such that the heteroepitaxial structures protrude from thedielectric layer to form the fins 52. In some embodiments wherehomoepitaxial or heteroepitaxial structures are epitaxially grown, theepitaxially grown materials may be in situ doped during growth, whichmay obviate prior and subsequent implantations although in situ andimplantation doping may be used together.

Still further, it may be advantageous to epitaxially grow a material inn-type region 50N (e.g., an NMOS region) different from the material inp-type region 50P (e.g., a PMOS region). In various embodiments, upperportions of the fins 52 may be formed from silicon-germanium(Si_(x)Ge_(1-x), where x can be in the range of 0 to 1), siliconcarbide, pure or substantially pure germanium, a III-V compoundsemiconductor, a II-VI compound semiconductor, or the like. For example,the available materials for forming III-V compound semiconductorinclude, but are not limited to, indium arsenide, aluminum arsenide,gallium arsenide, indium phosphide, gallium nitride, indium galliumarsenide, indium aluminum arsenide, gallium antimonide, aluminumantimonide, aluminum phosphide, gallium phosphide, and the like.

Further in FIG. 6, appropriate wells (not shown) may be formed in thefins 52 and/or the substrate 50. In some embodiments, a P well may beformed in the n-type region 50N, and an N well may be formed in thep-type region 50P. In some embodiments, a P well or an N well are formedin both the n-type region 50N and the p-type region 50P.

In the embodiments with different well types, the different implantsteps for the n-type region 50N and the p-type region 50P may beachieved using a photoresist and/or other masks (not shown). Forexample, a photoresist may be formed over the fins 52 and the STIregions 56 in the n-type region 50N. The photoresist is patterned toexpose the p-type region 50P of the substrate 50. The photoresist can beformed by using a spin-on technique and can be patterned usingacceptable photolithography techniques. Once the photoresist ispatterned, an n-type impurity implant is performed in the p-type region50P, and the photoresist may act as a mask to substantially preventn-type impurities from being implanted into the n-type region 50N. Then-type impurities may be phosphorus, arsenic, antimony, or the likeimplanted in the region to a concentration of equal to or less than 10¹⁸cm⁻³, such as between about 10¹⁶ cm⁻³ and about 10¹⁸ cm⁻³. After theimplant, the photoresist is removed, such as by an acceptable ashingprocess.

Following the implanting of the p-type region 50P, a photoresist isformed over the fins 52 and the STI regions 56 in the p-type region 50P.The photoresist is patterned to expose the n-type region 50N of thesubstrate 50. The photoresist can be formed by using a spin-on techniqueand can be patterned using acceptable photolithography techniques. Oncethe photoresist is patterned, a p-type impurity implant may be performedin the n-type region 50N, and the photoresist may act as a mask tosubstantially prevent p-type impurities from being implanted into thep-type region 50P. The p-type impurities may be boron, boron fluoride,indium, or the like implanted in the region to a concentration of equalto or less than 10¹⁸ cm⁻³, such as between about 10¹⁶ cm⁻³ and about10¹⁸ cm⁻³. After the implant, the photoresist may be removed, such as byan acceptable ashing process.

After the implants of the n-type region 50N and the p-type region 50P,an anneal may be performed to repair implant damage and to activate thep-type and/or n-type impurities that were implanted. In someembodiments, the grown materials of epitaxial fins may be in situ dopedduring growth, which may obviate the implantations, although in situ andimplantation doping may be used together.

In FIG. 7, a dummy dielectric layer 60 is formed on the fins 52. Thedummy dielectric layer 60 may be, for example, silicon oxide, siliconnitride, a combination thereof, or the like, and may be deposited orthermally grown according to acceptable techniques. A dummy gate layer62 is formed over the dummy dielectric layer 60, and a mask layer 64 isformed over the dummy gate layer 62. The dummy gate layer 62 may bedeposited over the dummy dielectric layer 60 and then planarized, suchas by a CMP. The mask layer 64 may be deposited over the dummy gatelayer 62. The dummy gate layer 62 may be a conductive or non-conductivematerial and may be selected from a group including amorphous silicon,polycrystalline-silicon (polysilicon), poly-crystallinesilicon-germanium (poly-SiGe), metallic nitrides, metallic silicides,metallic oxides, and metals. The dummy gate layer 62 may be deposited byphysical vapor deposition (PVD), CVD, sputter deposition, or othertechniques for depositing the selected material. The dummy gate layer 62may be made of other materials that have a high etching selectivity fromthe etching of isolation regions, e.g., the STI regions 56 and/or thedummy dielectric layer 60. The mask layer 64 may include one or morelayers of, for example, silicon nitride, silicon oxynitride, or thelike. In this example, a single dummy gate layer 62 and a single masklayer 64 are formed across the n-type region 50N and the p-type region50P. It is noted that the dummy dielectric layer 60 is shown coveringonly the fins 52 for illustrative purposes only. In some embodiments,the dummy dielectric layer 60 may be deposited such that the dummydielectric layer 60 covers the STI regions 56, extending over the STIregions and between the dummy gate layer 62 and the STI regions 56.

FIGS. 8A through 24D illustrate various additional steps in themanufacturing of embodiment devices. FIGS. 8A through 24D illustratefeatures in either of the n-type region 50N, the p-type region 50P, orboth (note separately illustrated). For example, the structuresillustrated in FIGS. 8A through 24D may be applicable to both the n-typeregion 50N and the p-type region 50P. Differences (if any) in thestructures of the n-type region 50N and the p-type region 50P aredescribed in the text accompanying each figure.

In FIGS. 8A-8D, the mask layer 64 (see FIG. 7) may be patterned usingacceptable photolithography and etching techniques to form masks 70. Thepattern of the masks 70 may then be transferred to the dummy gate layer62 to form dummy gates 68. In some embodiments, the pattern of the masks70 may also be transferred to the dummy dielectric layer 60 by anacceptable etching technique to form dummy dielectrics 66. Collectively,each dummy gate stack 72 comprises the dummy dielectric 66, the dummygate 68, and the mask 70. The dummy gate stacks 72 cover respectivechannel regions of the fins 52. The pattern of the masks 70 may be usedto physically separate each of the dummy gate stacks 72 from adjacentdummy gate stacks 72. The dummy gate stacks 72 may also have alengthwise direction substantially perpendicular to the lengthwisedirection of respective epitaxial fins 52.

In FIGS. 9A-9D, first spacer layer 80 is formed on exposed surfaces ofthe dummy gate stacks 72, STI regions 56, and/or the fins 52. Adeposition may form the first spacer layer 80. The first spacer layer 80may be formed of silicon nitride (SiN), silicon carbonitride (SiCN),silicon oxycarbonitride (SiOCN), any combinations thereof, or the like,using, for example, CVD, PVD, PECVD, ALD, the like, or any suitableprocess. The first spacer layer 80 may be formed to a thickness ofbetween about 1 nm and about 10 nm.

In FIGS. 10A-10D, sacrificial liner 81 is formed on the first spacerlayer 80. In some embodiments, the sacrificial liner 81 is formed byoxidizing an upper surface of the first spacer layer 80, whichconsequently converts the upper surface of the first spacer layer 80 tothe sacrificial liner 81. The sacrificial liner 81 may be formed by CVD,PECVD, PVD, ALD the like, or any suitable process, wherein O₂, Ar, He,silane (Si—N—C—H), etc. precursor is flowed over the first spacer layer80 to deposit an oxide layer and oxidize the upper surface. Theprecursor may be supplied at a flowrate of between about 1 slm and about6 slm. The process may be performed at temperatures between about 200°C. and about 400° C. and at pressures between about 1 Torr and about 3Torr. However, any suitable parameters may be utilized. The resultingsacrificial liner 81 is formed to have a high etch selectivity with thefirst spacer layer 80. For example, in embodiments in which the firstspacer layer 80 comprises silicon nitride (SiN), silicon carbonitride(SiCN), or silicon oxycarbonitride (SiOCN), the sacrificial liner 81 maycomprise silicon dioxide (SiO₂). Although not specifically illustrated,in some embodiments, during the process a thin layer of, for example,silicon oxide, may form over the sacrificial liner 81. In those cases,the thin layer disposed over the sacrificial liner 81 may be removed bya wet isotropic etch using hydrogen fluoride (HF), water, or a dry etchusing HF, NH₃, the like, any combinations thereof, or any suitableetchants. Following the etch, the sacrificial liner 81 remains along anupper surface of the remaining portion of the first spacer layer 80. Thesacrificial liner 81 may have a thickness of between about 2 nm andabout 5 nm. In addition, after the upper surface of the first spacerlayer 80 is converted, the first spacer layer 80 may have a thickness ofbetween about 1 nm and about 10 nm.

After the formation of the first spacer layer 80 and the sacrificialliner 81, implants for lightly doped source/drain (LDD) regions (notexplicitly illustrated) may be performed. In the embodiments withdifferent device types, similar to the implants discussed above in FIG.6, a mask, such as a photoresist, may be formed over the n-type region50N, while exposing the p-type region 50P, and appropriate type (e.g.,p-type) impurities may be implanted into the exposed fins 52 in thep-type region 50P. The mask may then be removed. Subsequently, a mask,such as a photoresist, may be formed over the p-type region 50P whileexposing the n-type region 50N, and appropriate type impurities (e.g.,n-type) may be implanted into the exposed fins 52 in the n-type region50N. The mask may then be removed. The n-type impurities may be the anyof the n-type impurities previously discussed, and the p-type impuritiesmay be the any of the p-type impurities previously discussed. Thelightly doped source/drain regions may have a concentration ofimpurities from about 10¹⁵ cm⁻³ to about 10¹⁹ cm⁻³. An anneal may beused to repair implant damage and to activate the implanted impurities.

In FIGS. 11A-11D, a second spacer layer 86 is formed by conformallydepositing an insulating material over the sacrificial liner 81 alongsidewalls of the dummy gate stacks 72. The insulating material of thesecond spacer layer 86 may be silicon nitride (SiN), silicon dioxide(SiO₂), silicon oxynitride (SiON), silicon carbonitride (SiCN), siliconoxycarbonitride (SiOCN), any combinations thereof, or the like. Thesecond spacer layer 86 may be formed by CVD, PVD, PECVD, ALD, the like,or any suitable process. In some embodiments, the second spacer layer 86comprises at least one of the foregoing oxygen-containing substances,such as SiOCN. The second spacer layer 86 may have a thickness in arange between about 1 nm and about 10 nm. The second spacer layer 86 isformed to have a similar etch selectivity as the sacrificial liner 81 aswell as a high etch selectivity with the first spacer layer 80 andsubsequently formed overlying layers. For example, in embodiments inwhich the first spacer layer comprises silicon nitride (SiN), siliconcarbonitride (SiCN), or silicon oxycarbonitride (SiOCN) and thesacrificial liner 81 comprises silicon dioxide (SiO₂), the second spacerlayer 86 may comprise silicon nitride (SiN), silicon dioxide (SiO₂),silicon oxynitride (SiON), silicon carbonitride (SiCN), or siliconoxycarbonitride (SiOCN). As discussed in detail below, the second spacerlayer 86 and the sacrificial liner 81 will be selectively etched to formair spacers.

It is noted that the above disclosure generally describes a process offorming spacers and LDD regions. Other processes and sequences may beused. For example, although not specifically illustrated, fewer oradditional spacers may be utilized, a different sequence of steps may beutilized (e.g., the first spacer layer 80 and the sacrificial liner 81may be anisotropically etched prior to forming the second spacer layer86), spacers may be formed and removed, and/or the like. Furthermore,the n-type and p-type devices may be formed using different structuresand steps. For example, LDD regions for n-type devices may be formedprior to forming the second spacer layer 86 while the LDD regions forp-type devices may be formed after forming the second spacer layer 86.

FIGS. 12A-12D thru FIGS. 14A-14D illustrated formation of source/drainregions in the p-type region 50P and the n-type region 50N. Note thatthe process that is described may be performed first on only the p-typeregion 50P or the n-type region 50N at a time while the second region ismasked (not specifically illustrated). Afterward, the mask is removed,and another mask (also not specifically illustrated) is formed over thefirst region. At which point, the process that is described may beperformed on the exposed second region. Also note that various aspectsof the process may be the same or different between the p-type region50P and the n-type region 50N.

In FIGS. 12A-12D, a third spacer layer 90 is formed over the secondspacer layer 86, the STI regions 56, and exposed portions of the fins52. The third spacer layer 90 controls the spacing between thesubsequently formed source/drain regions and gate electrode. A p-typethird spacer layer 90 may be formed in the p-type region 50P and ann-type third spacer layer 90 may be formed in the n-type region 50Nsimultaneously or separately by masking each region while forming thelayer in the other region. The third spacer layer 90 may be formed withthe same or different materials and at the same or differentthicknesses. The third spacer layer 90 may also be formed separately forsemiconductor devices within the same region (e.g., the p-type region50P or the n-type region 50N). For example, the third spacer layer 90may comprise silicon nitride (SiN), silicon carbonitride (SiCN), siliconoxycarbonitride (SiOCN), the like, or any combinations thereof and maybe formed by CVD, PVD, PECVD, ALD, the like, or any suitable process.During subsequent processing steps, oxygen may diffuse into and oxidize(or further oxidize) the third spacer layer 90. The third spacer layer90 (e.g., silicon oxynitride) may have an etch selectivity that is thesame or similar to that of the sacrificial liner 81 and/or the secondspacer layer 86. In some embodiments, during subsequent steps, the thirdspacer layer 90 may be oxidized or chemically changed in a way to givethe third spacer layer 90 an etch selectivity that is the same or closerto that of the sacrificial liner 81 and the second spacer layer 86. Forexample, in embodiments in which the first spacer layer 80 comprisessilicon nitride (SiN), silicon carbonitride (SiCN), or siliconoxycarbonitride (SiOCN); the sacrificial liner 81 comprises silicondioxide (SiO₂); and the second spacer layer 86 comprises silicon nitride(SiN), silicon dioxide (SiO₂), silicon oxynitride (SiON), siliconcarbonitride (SiCN), or silicon oxycarbonitride (SiOCN); the thirdspacer layer 90 may comprise silicon nitride (SiN), silicon carbonitride(SiCN), or silicon oxycarbonitride (SiOCN).

In FIGS. 13A-13D, an etching process may be performed to form recesses94 in the fins 52 on lateral sides of the dummy gate stacks 72. Therecesses 94 may be formed using anisotropic etching processes, such asreactive-ion etching (RIE), neutral beam etching (NBE), the like, or anysuitable process. As illustrated in FIGS. 13B and 13C, portions of thefirst spacer layer 80, the sacrificial liner 81, the second spacer layer86, and the third spacer layer 90 overlying portions of the fins 52 maybe removed by the etching process. In addition, as illustrated in FIGS.13B and 13D, other portions of the first spacer layer 80, thesacrificial liner 81, the second spacer layer 86, and the third spacerlayer 90 overlying portions of the STI regions 56 may be removed by theetching process.

In FIGS. 14A-14D, epitaxial source/drain regions 96 are formed in therecesses 94 of the fins 52. The epitaxial source/drain regions 96 areformed in the fins 52 such that each dummy gate stack 72 is disposedbetween respective neighboring pairs of the epitaxial source/drainregions 96. In some embodiments the epitaxial source/drain regions 96may extend into, and may also penetrate through, the fins 52. In someembodiments, the third spacer layer 90 serves to control short channeleffects, threshold voltage, and other performance characteristics of theFinFET by controlling a distance between the source/drain regions 96 andsubsequently formed gate electrodes. A material of the epitaxialsource/drain regions 96 may be selected to exert stress in therespective channel regions, thereby improving performance.

As alluded to above, some regions of the substrate may be masked (notspecifically illustrated) while one or more of the above steps (e.g.,with respect to FIGS. 12A-14D) may be performed on unmasked regions.Thereafter, those masks may be removed and new masks (also notspecifically illustrated) may be placed over other regions of thesubstrate, and one or more of the above steps may be repeated for theunmasked regions, thereby allowing different configurations and/ormaterials to be used for different transistors, such as p-typetransistors and n-type transistors.

The epitaxial source/drain regions 96 in the p-type region 50P mayinclude any acceptable material, such as appropriate for p-type FinFETs.For example, if the fin 52 is silicon, the epitaxial source/drainregions 96 in the p-type region 50P may comprise materials exerting acompressive strain in the channel region, such as silicon-germanium,germanium, germanium tin, or the like. The epitaxial source/drainregions 96 in the p-type region 50P may have surfaces raised fromrespective surfaces of the fins 52 and may have facets.

The epitaxial source/drain regions 96 in the n-type region 50N mayinclude any acceptable material, such as appropriate for n-type FinFETs.For example, if the fin 52 is silicon, the epitaxial source/drainregions 96 in the n-type region 50N may comprise materials exerting atensile strain in the channel region, such as silicon, silicon carbide,silicon phosphide, or the like. The epitaxial source/drain regions 96 inthe n-type region 50N may have surfaces raised from respective surfacesof the fins 52 and may have facets.

The epitaxial source/drain regions 96 and/or the fins 52 may beimplanted with dopants similarly to the process previously discussed forforming lightly-doped source/drain regions, followed by an anneal. Thesource/drain regions may have an impurity concentration of between about10¹⁹ cm⁻³ and about 10²¹ cm⁻³. The n-type and/or p-type impurities forsource/drain regions may be any of the impurities previously discussed.In some embodiments, the epitaxial source/drain regions 96 may be insitu doped during growth.

As a result of the epitaxy processes used to form the epitaxialsource/drain regions 96 in the n-type region 50N and the p-type region50P, upper surfaces of the epitaxial source/drain regions 96 have facetswhich expand laterally outward beyond sidewalls of the fins 52. In someembodiments, these facets cause adjacent source/drain regions 96 of asame FinFET to merge as illustrated by FIG. 14B. In other embodiments,adjacent source/drain regions 96 remain separated after the epitaxyprocess is completed.

Following formation of the epitaxial source/drain regions 96, a cleaningprocess may be performed. In some embodiments, the cleaning process mayremove exposed portions of the third spacer layer 90, such as from overand around the dummy gate stacks 72. Note that other portions of thethird spacer layer 90 may remain in less exposed locations, such asportions underlying the epitaxial source/drain regions 96 as illustratedin FIG. 14B and portions sandwiched between the epitaxial source/drainregions 96 and the dummy gate stacks 72 (or, specifically, portions ofthe second spacer layer 86, the sacrificial liner 81, and the firstspacer layer 80 extending along sidewalls of the dummy gate stack 72) asillustrated in FIG. 14D. In other embodiments, the third spacer layer 90may not be removed during the cleaning process and may, therefore,remain in underlying the source/drain regions 96.

In FIGS. 15A-15D, a fourth spacer layer 98 is formed over thesource/drain regions 96 and the dummy gate stacks 72. The fourth spacerlayer 98 may serve as a contact etch stop layer, such as when formingopenings for contact plugs. The fourth spacer layer 98 may be formed byconformally depositing an insulating material. The insulating materialof the fourth spacer layer 98 may be silicon nitride (SiN), siliconcarbonitride (SiCN), silicon oxycarbonitride (SiOCN), any combinationsthereof, or the like. The fourth spacer layer 98 may be formed of amaterial to exhibit a high etch selectivity as compared with certainoverlying layers thereby allowing an etching process to form an openingthrough the overlying layers to be effectively stopped.

In addition, the fourth spacer layer 98 may be formed of a material toexhibit a high etch selectivity as compared with certain underlyinglayers, such as the sacrificial liner 81, the second spacer layer 86,and the third spacer layer 90. As discussed in greater detail below, thesacrificial liner 81, the second spacer layer 86, and the third spacerlayer 90 may be removed, thereby creating an air gap having a lowerdielectric constant. As such, the first spacer layer 80 and the fourthspacer layer 98 may be formed of materials having a low etch rate ascompared with the materials of the sacrificial liner 81, the secondspacer layer 86, and the third spacer layer 90, thereby allowing thesacrificial liner 81, the second spacer layer 86, and the third spacerlayer 90 to be removed with little or no etching of the first spacerlayer 80 and the fourth spacer layer 98.

For example, in embodiments in which the first spacer layer 80 comprisessilicon nitride (SiN), silicon carbonitride (SiCN), or siliconoxycarbonitride (SiOCN); the sacrificial liner 81 comprises silicondioxide (SiO₂); the second spacer layer 86 comprises silicon nitride(SiN), silicon dioxide (SiO₂), silicon oxynitride (SiON), siliconcarbonitride (SiCN), or silicon oxycarbonitride (SiOCN); the thirdspacer layer comprises silicon nitride (SiN), silicon carbonitride(SiCN), or silicon oxycarbonitride (SiOCN); the fourth spacer layer 98may comprise silicon nitride (SiN), silicon carbonitride (SiCN), orsilicon oxycarbonitride (SiOCN). The fourth spacer layer 98 may beformed by CVD, PVD, PECVD, ALD, the like, or any suitable process. Thefourth spacer layer 98 may have a thickness of between about 1 nm andabout 10 nm.

In FIGS. 16A-16D, a first interlayer dielectric (ILD) 100 is depositedover the dummy gate stacks 72, the STI regions 56, and the source/drainregions 96. The first ILD 100 may be formed of a dielectric material,and may be deposited by any suitable method, such as CVD,plasma-enhanced CVD (PECVD), or FCVD. Dielectric materials may includephospho-silicate glass (PSG), boro-silicate glass (BSG), boron-dopedphospho-silicate glass (BPSG), undoped silicate glass (USG), or thelike. Other insulation materials formed by any acceptable process may beused.

Further, a planarization process, such as a CMP, may be performed tolevel the top surface of the first ILD 100 with the top surfaces of thedummy gate stacks 72. The planarization process may remove the masks 70on the dummy gates 68, and portions of the first spacer layer 80, thesacrificial liner 81, the second spacer layer 86, and the fourth spacerlayer 98 that may be along sidewalls of the masks 70 (as well as thethird spacer layer 90 if portions remain over and around the dummy gatestacks 72). After the planarization process, top surfaces of the dummygates 68, the first spacer layer 80, the sacrificial liner 81, thesecond spacer layer 86, and the fourth spacer layer 98 are level.Accordingly, the top surfaces of the dummy gates 68 are exposed throughthe first ILD 100. In some embodiments not specifically illustrated, themasks 70 may remain, in which case the planarization process levels thetop surface of the first ILD 100 with the masks 70.

In FIGS. 17A-17D, the dummy gates 68, and the masks 70 if present, areremoved in an etching step(s), so that recesses 102 are formed. Portionsof the dummy dielectrics 66 in the recesses 102 may also be removed asillustrated in FIGS. 17A-17D. In some embodiments, only the dummy gates68 are removed and the dummy dielectrics 66 remain and are exposed bythe recesses 102. In some embodiments, the dummy dielectrics 66 areremoved from recesses 102 in a first region of a die (e.g., a core logicregion) and remain in recesses 102 in a second region of the die (e.g.,an input/output region). In some embodiments, the dummy gates 68 areremoved by an anisotropic dry etch process. For example, the etchingprocess may include a dry etch process using reaction gas(es) thatselectively etch the dummy gates 68 with little or no etching of thefirst ILD 100 or the first spacer layer 80, the sacrificial liner 81,the second spacer layer 86, and the fourth spacer layer 98. Each recess102 exposes and/or overlies a channel region of a respective fin 52.Each channel region is disposed between neighboring pairs of theepitaxial source/drain regions 96. During the removal, the dummydielectrics 66 may be used as etch stop layers when the dummy gates 68are etched. The dummy dielectrics 66 may then be optionally removedafter the removal of the dummy gates 68 by a suitable etching process.

In FIGS. 18A-18D, gate dielectric layers 106 and gate electrodes 108 areformed for replacement gates 112. Gate dielectric layers 106 maycomprise one or more layers deposited in the recesses 102, such as onthe top surfaces and the sidewalls of the fins 52 and on sidewalls ofthe first spacer layer 80. The gate dielectric layers 106 may also beformed on the top surface of the first ILD 100. In some embodiments, thegate dielectric layers 106 comprise one or more dielectric layers, suchas one or more layers of silicon oxide, silicon nitride, metal oxide,metal silicate, or the like. For example, in some embodiments, the gatedielectric layers 106 include an interfacial layer 104 (separatelyillustrated) of silicon oxide formed by thermal or chemical oxidationand an overlying high-k dielectric material, such as a metal oxide or asilicate of hafnium, aluminum, zirconium, lanthanum, manganese, barium,titanium, lead, and combinations thereof. The gate dielectric layers 106may include a dielectric layer having a k value greater than about 7.0.The formation methods of the gate dielectric layers 106 may includeMolecular-Beam Deposition (MBD), ALD, PECVD, and the like. Inembodiments where portions of the dummy dielectrics 66 remain in therecesses 102, the gate dielectric layers 106 (such as the interfacialoxide layer 104) include a material of the dummy dielectrics 66 (e.g.,SiO₂).

The gate electrodes 108 are deposited over the gate dielectric layers106, respectively, and fill the remaining portions of the recesses 102.The gate electrodes 108 may include a metal-containing material such astitanium nitride, titanium oxide, tantalum nitride, tantalum carbide,cobalt, ruthenium, aluminum, tungsten, combinations thereof, ormulti-layers thereof. For example, although a single layer gateelectrode 108 is illustrated, the gate electrode 108 may comprise anynumber of liner layers, any number of work function tuning layers, and afill material (none of which specifically illustrated). After thefilling of the recesses 102, a planarization process, such as a CMP, maybe performed to remove the excess portions of the gate dielectric layers106 and the material of the gate electrodes 108, which excess portionsare over the top surface of the first ILD 100. The remaining portions ofmaterial of the gate electrodes 108 and the gate dielectric layers 106thus form replacement gates 112 of the resulting FinFETs. The gateelectrodes 108 and the gate dielectric layers 106 may be collectivelyreferred to as a “gate stack.” The gate stacks may further extend alongsidewalls of a channel region of the fins 52.

The formation of the gate dielectric layers 106 in the n-type region 50Nand the p-type region 50P may occur simultaneously such that the gatedielectric layers 106 in each region are formed from the same materials,and the formation of the gate electrodes 108 may occur simultaneouslysuch that the gate electrodes 108 in each region are formed from thesame materials. In some embodiments, the gate dielectric layers 106 ineach region may be formed by distinct processes, such that the gatedielectric layers 106 may be different materials/thicknesses, and/or thegate electrodes 108 in each region may be formed by distinct processes,such that the gate electrodes 108 may be differentmaterials/thicknesses. Various masking steps may be used to mask andexpose appropriate regions when using distinct processes.

In FIGS. 19A-19D, the gate electrodes 108 may be cut to form distinctgate electrodes 108 for different fins 52 or groups of fins 52. Forexample, portions of the gate electrodes 108 may be masked, and theexposed regions may be etched, such as anisotropically etched. A firstrefill layer 116 may then be formed in the cut regions. The first refilllayer 116 may comprise one or more layers of dielectric material,including silicon nitride (SiN), the like, or any combinations thereof.During deposition of the first refill layer 116, an upper region may getpinched off and form a seam 117 as illustrated.

In FIGS. 20A-20D, the first ILD layer 100 is recessed, and a cappinglayer 118 is formed over the first ILD layer 100 and the gate electrodes108. The capping layer 118 serves to protect the first ILD layer 100during subsequent etching steps. For example, as discussed in greaterdetail below, the capping layer 118 protects the first ILD layer 100while etching the sacrificial liner 81, the second spacer layer 86, andthe third spacer layer 90. As such, it may be desirable to select amaterial for the capping layer 118 that exhibits a low etch rate ascompared to the etch rate of the sacrificial liner 81, the second spacerlayer 86, and the third spacer layer 90, thereby allowing removal of thesacrificial liner 81, the second spacer layer 86, and the third spacerlayer 90 with little or no etching of the capping layer 118. Forexample, in embodiments in which the first spacer layer 80 comprisessilicon nitride (SiN), silicon carbonitride (SiCN), or siliconoxycarbonitride (SiOCN); the sacrificial liner 81 comprises silicondioxide (SiO₂); the second spacer layer 86 comprises silicon nitride(SiN), silicon dioxide (SiO₂), silicon oxynitride (SiON), siliconcarbonitride (SiCN), or silicon oxycarbonitride (SiOCN); the thirdspacer layer 90 comprises silicon nitride (SiN), silicon carbonitride(SiCN), or silicon oxycarbonitride (SiOCN); the fourth spacer layercomprises silicon nitride (SiN), silicon carbonitride (SiCN), or siliconoxycarbonitride (SiOCN); the capping layer 118 may comprise siliconoxycarbide (SiOC), silicon carbonitride (SiCN), or silicon nitride(SiN). The capping layer 118 may be formed by CVD, PVD, ALD, PECVD, thelike, or any suitable process. A planarization process (e.g., CMP) isperformed to remove portions of the capping layer 118 over the gateelectrodes 108.

In FIGS. 21A-21E, air spacers (or air gaps) 120 are formed by etchingthe second spacer layer 86 and the sacrificial liner 81. In addition,portions or all of the third spacer layer 90 may also be etched. Thefigures illustrate a complete etching of entireties of the sacrificialliner 81, the second spacer layer 86, and the third spacer layer 90.However, as described in greater detail below, in accordance with someembodiments, the etching may be stopped before reaching full completion(not specifically illustrated). As a reminder, FIG. 21C illustrates theC-C cross-section from FIG. 1 and also labeled in FIG. 21A.Additionally, FIG. 21D illustrates the D-D cross-section from FIG. 1 andalso labeled in FIG. 21B. Further, FIG. 21E illustrates an E-Ecross-section, which is not labeled in FIG. 1 but is labeled in FIG.21B. Referring briefly to FIG. 21E, although the epitaxial source/drainregion 96 is illustrated as having a lower edge being substantially flatand parallel to upper surfaces of the STI regions 56 and/or the firstspacer layer 80, the lower edge of the epitaxial source/drain region 96may instead have a convex U-shape such that a central portion is moreproximal than an outer portion to the underlying STI region 56.

The etch to form the air spacers 120 may be an isotropic etch and maycomprise any suitable wet or dry etchant. For example, in embodiments inwhich the first spacer layer 80 comprises silicon nitride (SiN), siliconcarbonitride (SiCN), silicon oxycarbonitride (SiOCN); the sacrificialliner 81 comprises silicon dioxide (SiO₂); the second spacer layer 86comprises silicon nitride (SiN), silicon dioxide (SiO₂), siliconoxynitride (SiON), silicon carbonitride (SiCN), or siliconoxycarbonitride (SiOCN); the third spacer layer 90 comprises siliconnitride (SiN), silicon carbonitride (SiCN), or silicon oxycarbonitride(SiOCN); the fourth spacer layer 98 comprises silicon nitride (SiN),silicon carbonitride (SiCN), or silicon oxycarbonitride (SiOCN); and thecapping layer 118 comprises silicon oxycarbide (SiOC), siliconcarbonitride (SiCN), or silicon nitride (SiN); a dry etch process usingHF, H₂O_((g)) may be used to selectively etch the sacrificial liner 81,the second spacer layer 86, and the third spacer layer 90, with littleor no etching of first spacer layer 80, the fourth spacer layer 98, andthe capping layer 118. Consequently, the first spacer layer 80 and thefourth spacer layer 98 remain after the wet etch. Although notspecifically illustrated, portions of one or more of the gate dielectriclayers 106 (e.g., oxides such as hafnium oxide) may be etched duringsuch a wet etch process.

As illustrated, the air spacers 120 may extend along the first spacerlayer 80 adjacent to the replacement gates 112 as well as under andbetween source/drain regions 96. As illustrated in FIGS. 21C-21E,portions of the air spacers 120 at various depths D₁, D₂, and D₃(measured from an upper surface of the first spacer layer 80) in eachcross-section may have thicknesses T₁, T₂, and T₃ (measured in lateraldirections). For example, depth D₁ may be between about 15 nm and about50 nm, depth D₂ may be between about 20 nm and about 60 nm, and depth D₃may be between about 60 nm and about 120 nm. In addition, thickness T₁may be between about 1 nm and about 4 nm, thickness T₂ may be betweenabout 2 nm and about 8 nm, and thickness T₃ may be between about 15 nmand about 30 nm. As illustrated in FIG. 21B, the air spacers may have adepth D₄ (measured from below outer portions of the epitaxialsource/drain regions 96 to the first spacer layer 80), the depth D₄being between about 10 nm and about 40 nm. As illustrated in FIG. 21Eand as described above, a lower edge of the epitaxial source/drainregion 96 may be substantially flat or have a convex U-shape, such thatthe air spacers 120 may also have a depth D₅ (measured from belowcentral portions of the epitaxial source/drain regions 96 to the firstspacer layer 80), the depth D₅ being between about 5 nm and about 40 nm.

In some embodiments, the FinFET devices in the n-type region 50N and inthe p-type region 50P are etched at the same time. The combination ofthe second spacer layer 86 and the sacrificial liner 81 provide agreater total thickness and composition for etching than if only thesecond spacer layer 86 were being etched. The greater total thicknessand composition benefits the process of forming the air spacers 120 inmultiple ways. The second spacer layer 86 may be formed to a lesserthickness, which reduces the effects that the second spacer layer 86 mayhave on neighboring or nearby layers during subsequent processing steps.For example, the greater total thickness and composition increases theetch rate and yield in both regions (e.g., the n-type region 50N and thep-type region 50P) by providing more space for the etchant to reachlower portions of the second spacer layer 86 and the sacrificial liner81 along the first spacer layer 80 and the replacement gates 112. Forexample, the etch rate of the second spacer layer 86 and the sacrificialliner 81 may be between about 100% and about 200% faster than the etchrate would be for only the second spacer layer 86.

In addition, although the second spacer layer 86 and the sacrificialliner 81 may not etch at the exact same rate in the p-type region 50P ascompared to the n-type region due to differences in thicknesses andcompositions of some layers as well as other treatment processes, thegreater total thickness and corresponding increased etch rates reducethe disparity. As discussed above, the second spacer layer 86 in thep-type region 50P may be doped with boron, while the second spacer layer86 in the n-type region 50N may be doped with phosphorous. The etchants(e.g., hydrogen fluoride and water) may more efficiently etch thephosphorous-doped regions of the second spacer layer 86 as compared tothe boron-doped regions of the second spacer layer 86. Due to one ormore of these differences between the regions, the etch rate to form theair spacers 120 in the p-type region 50P may be some degree slower thanthe etch rate to form the air spacers 120 in the n-type region 50N.However, the greater total thickness for etching reduces the differencesbetween the etch rates between the p-type region 50P and the n-typeregion 50N—that is, an N-P loading. For example, when the air spacer 120in the p-type region 50P reaches a depth of about 65 nm, the air spacer120 in the n-type region 50N may have etched about 17 nm further. Inaddition, when the air spacer 120 in the p-type region 50P reaches adepth of about 88 nm (or almost the full height of the replacement gate112, such as to the first spacer layer 80), the air spacer 120 in then-type region 50N may have etched about 1 nm further.

Further, the increased etch rates in forming the air spacers 120 reduceunwanted etching of other exposed features, such as the gate dielectriclayers 106 and/or the gate electrodes 108. For example, as alluded toabove, one or more of the gate dielectric layers 106 (e.g., a high-kdielectric layer) may lose about 5% less, or up to about 10% less, whenetching the second spacer layer 86 and the sacrificial liner 81 ascompared to what may be lost from the one or more gate dielectric layers106 if etching only the second spacer layer 86 as a result of lessetching time.

In FIGS. 22A-22D, a second refill layer 124 is deposited over the gateelectrodes 108, over the capping layer 118, and into the upper portionsof the air spacers 120. As illustrated, the second refill layer 124accumulates in the upper portions of the air spacers 120 withoutdepositing throughout other portions of the air spacers 120. The secondrefill layer 124 may comprise silicon nitride (SiN), siliconcarbonitride (SiCN), silicon oxycarbonitride (SiOCN) the like, or anycombinations thereof. The second refill layer 124 may be formed by CVD,PVD, ALD, PECVD, the like, or any suitable process. Following thedeposition of the second refill layer 124, a planarization process, suchas CMP, may be performed to remove excess portions of the second refilllayer 124 as well as the capping layer 118. Portions of the secondrefill layer 124 remain within the upper portions of the air spacers 120and serve to cap the air spacers 120 to prevent or reduce othernon-gaseous materials from getting into the air spacers 120 duringsubsequent processing steps. The second refill layer 124 may have athickness in a range between about 5 nm and about 20 nm.

Although not specifically illustrated, a gate mask may be formed overthe replacement gate 112 (e.g., the gate dielectric layers 106 and thegate electrode 108), and the gate mask may be disposed between opposingportions of the first spacer layer 80. In some embodiments, forming thegate mask includes recessing the replacement gate so that a recess isformed directly over the replacement gate 112 and between opposingportions of the first spacer layer 80. A gate mask comprising one ormore layers of dielectric material, such as silicon nitride, siliconoxynitride, or the like, is filled in the recess, followed by aplanarization process to remove excess portions of the dielectricmaterial extending over the first ILD 100.

In FIGS. 23A-23D, a second ILD 130 is deposited over the first ILD 100.In some embodiments, the second ILD 130 is a flowable film formed by aflowable CVD method. In some embodiments, the second ILD 130 is formedof a dielectric material such as PSG, BSG, BPSG, USG, or the like, andmay be deposited by any suitable method, such as CVD and PECVD. Thesubsequently formed gate contacts 134 (FIGS. 24A-24E) penetrate throughthe second ILD 130 to contact the top surface of the gate electrode 108.In some embodiments, a contact etch stop layer (CESL) (not specificallyillustrated) is disposed between the second ILD 130 and the replacementgates 112 and the first ILD 100. The CESL may comprise a dielectricmaterial, such as, silicon nitride, silicon oxide, silicon oxynitride,or the like, having a lower etch rate than the material of the overlyingsecond ILD 130.

In FIGS. 24A-24E, gate contacts 134 are formed through the second ILD130, and source/drain contacts 136 are formed through the second ILD 130and the first ILD 100, in accordance with some embodiments. As discussedabove, the figures illustrate a complete etching of entireties of thesacrificial liner 81, the second spacer layer 86, and the third spacerlayer 90. However, in accordance with some embodiments, the etching mayhave been stopped before reaching full completion (not specificallyillustrated). FIG. 24C illustrates the C-C cross-section from FIG. 1 andalso labeled in FIG. 24A. Additionally, FIG. 24D illustrates the D-Dcross-section from FIG. 1 and also labeled in FIG. 24B. Further, FIG.24E illustrates the E-E cross-section, which is not labeled in FIG. 1but is labeled in FIG. 24B.

Openings for the source/drain contacts 136 are formed through the firstand second ILDs 100 and 130, respectively, and the fourth spacer layer98. Openings for the gate contact 134 are formed through the second ILD130. The openings may be formed using acceptable photolithography andetching techniques. A liner (not shown), such as a diffusion barrierlayer, an adhesion layer, or the like, and a conductive material areformed in the openings. The liner may include titanium, titaniumnitride, tantalum, tantalum nitride, or the like. The conductivematerial may be copper, a copper alloy, silver, gold, tungsten, cobalt,aluminum, nickel, or the like. A planarization process, such as a CMP,may be performed to remove excess material from a surface of the secondILD 130. The remaining liner and conductive material form thesource/drain contacts 136 and gate contacts 134 in the openings. Ananneal process may be performed to form a silicide at the interfacebetween the epitaxial source/drain regions 96 and the source/draincontacts 136. The source/drain contacts 136 are physically andelectrically coupled to the epitaxial source/drain regions 96, and thegate contacts 134 are physically and electrically coupled to the gateelectrodes 108. The source/drain contacts 136 and gate contacts 134 maybe formed in different processes, or may be formed in the same process.Although shown as being formed in the same cross-sections, it should beappreciated that each of the source/drain contacts 136 and gate contacts134 may be formed in different cross-sections, which may avoid shortingof the contacts.

As illustrated, as a result of the second refill layer 124 filling upperportions of the air spacers 120, the air spacers 120 may extend atsomewhat different dimensions along the first spacer layer 80 adjacentto the replacement gates 112 as well as under and between source/drainregions 96. As illustrated in FIGS. 24C-24E, portions of the air spacers120 at various depths D₁′, D₂′, and D₃′ may be measured from a bottomsurface of the second refill layer 124, while portions of the airspacers 120 at depths D₄ and D₅ may be unaffected by the second refilllayer 124. In addition, the thicknesses T₁, T₂, and T₃ may be unaffectedby the second refill layer 124. For example, depth D₁′ may be betweenabout 5 nm and about 30 nm, depth D₂′ may be between about 10 nm andabout 40 nm, and depth D₃′ may be between about 40 nm and about 80 nm.

The disclosed FinFET embodiments could also be applied to nanostructuredevices such as nanostructure (e.g., nanosheet, nanowire,gate-all-around, or the like) field effect transistors (NSFETs). In anNSFET embodiment, the fins are replaced by nanostructures formed bypatterning a stack of alternating layers of channel layers andsacrificial layers. Dummy gate stacks and source/drain regions areformed in a manner similar to the above-described embodiments. After thedummy gate stacks are removed, the sacrificial layers can be partiallyor fully removed in channel regions. The replacement gate structures areformed in a manner similar to the above-described embodiments, thereplacement gate structures may partially or completely fill openingsleft by removing the sacrificial layers, and the replacement gatestructures may partially or completely surround the channel layers inthe channel regions of the NSFET devices. ILDs and contacts to thereplacement gate structures and the source/drain regions may be formedin a manner similar to the above-described embodiments. A nanostructuredevice can be formed as disclosed in U.S. Patent Application PublicationNo. 2016/0365414, which is incorporated herein by reference in itsentirety.

In an embodiment, a method of forming a semiconductor device includesforming a dummy gate stack over a substrate; forming a first spacerlayer over the dummy gate stack; oxidizing a surface of the first spacerlayer to form a sacrificial liner; forming one or more second spacerlayers over the sacrificial liner; forming a third spacer layer over theone or more second spacer layers; forming an inter-layer dielectric(ILD) layer over the third spacer layer; etching at least a portion ofthe one or more second spacer layers to form an air gap, the air gapbeing interposed between the third spacer layer and the first spacerlayer; and forming a refill layer to fill an upper portion of the airgap. In an embodiment, etching includes etching at least a portion ofthe sacrificial liner. In an embodiment, each of the one or more secondspacer layers and the sacrificial liner includes an oxide. In anembodiment, the method further includes, after forming the one or moresecond spacer layers, epitaxially growing source/drain region in thesubstrate adjacent the third spacer layer, wherein forming the thirdspacer layer includes forming the third spacer layer over thesource/drain regions. In an embodiment, the air gap extends along alower surface of the source/drain region. In an embodiment, the air gapextends along opposing sidewalls of the source/drain region. In anembodiment, the method further includes before the etching step, forminga capping layer over the ILD layer; and after the etching step,performing a planarization to remove the capping layer.

In another embodiment, a semiconductor structure includes a first finprotruding above an isolation region; a gate structure disposed over thefirst fin; a source/drain region over the first fin and adjacent thegate structure; an interlayer dielectric (ILD) disposed over thesource/drain region; a first spacer along a sidewall of the gatestructure, the first spacer being interposed between the ILD and thegate structure; and an air gap disposed over the first spacer, the airgap being laterally interposed between the ILD and the first spacer, theair gap being vertically interposed between the source/drain region andthe isolation region. In an embodiment, the first spacer contacts anupper surface of the first fin, an upper surface of the isolationregion, and the sidewall of the gate structure. In an embodiment, thestructure further includes a second spacer, the second spacer contactingthe upper surface of the isolation region and a bottom surface of theILD. In an embodiment, the air gap contacts a lower surface of thesource/drain region and a lower surface of the second spacer, whereinthe second spacer contacts an upper surface of the source/drain region.In an embodiment, the structure further includes an insulating materialdirectly interposed between the first spacer and the second spacer,wherein the air gap is bounded by the first spacer, the second spacer,the source/drain region, and the insulating material. In an embodiment,a portion of the air gap is directly interposed between the first spacerand the source/drain region.

In yet another embodiment, a semiconductor structure includes a shallowtrench isolation (STI) region interposed between a first fin and asecond fin; a first gate structure disposed over the STI region, thefirst fin, and the second fin; a second gate structure disposed over theSTI region, the first fin, and the second fin; a source/drain regiondisposed over the first fin and the second fin, the source/drain regionbeing interposed between the first gate structure and the second gatestructure; a first spacer along a sidewall of the first gate structure,a sidewall of the second gate structure, and an upper surface of the STIregion; a second spacer along an upper surface of the source/drainregion; and an air gap interposed between the first spacer and thesecond spacer, the air gap exposing a lower surface of the second spacerand a lower surface of the source/drain region. In an embodiment, theair gap extends between the source/drain region and the first gatestructure. In an embodiment, the air gap extends between thesource/drain region and the second gate structure. In an embodiment, thefirst spacer separates the air gap from the STI. In an embodiment, theair gap has a first width between the first spacer and the secondspacer, wherein the air gap has a second width between the first spacerand the source/drain region, wherein the first width is less than thesecond width. In an embodiment, the structure further includes a refillmaterial over the air gap and interposed between the first spacer andthe second spacer, an upper surface of the refill material being levelwith an upper surface of the first spacer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method of forming a semiconductor device, themethod comprising: forming a dummy gate stack over a substrate; forminga first spacer layer over the dummy gate stack; oxidizing a surface ofthe first spacer layer to form a sacrificial liner; forming one or moresecond spacer layers over the sacrificial liner; forming a third spacerlayer over the one or more second spacer layers; forming an inter-layerdielectric (ILD) layer over the third spacer layer; etching at least aportion of the one or more second spacer layers to form an air gap, theair gap being interposed between the third spacer layer and the firstspacer layer; and forming a refill layer to fill an upper portion of theair gap.
 2. The method of claim 1, wherein etching comprises etching atleast a portion of the sacrificial liner.
 3. The method of claim 2,wherein each of the one or more second spacer layers and the sacrificialliner comprises an oxide.
 4. The method of claim 1, wherein etching theone or more second spacer layers comprises etching an entirety of theone or more second spacer layers.
 5. The method of claim 1 furthercomprising, after forming the one or more second spacer layers,epitaxially growing source/drain region in the substrate adjacent thedummy gate stack, wherein forming the third spacer layer comprisesforming the third spacer layer over the source/drain regions.
 6. Themethod of claim 5, wherein the air gap extends along a lower surface ofthe source/drain region.
 7. The method of claim 5, wherein the air gapextends along opposing sidewalls of the source/drain region.
 8. Themethod of claim 1 further comprising: before the etching step, forming acapping layer over the ILD layer; and after the etching step, performinga planarization to remove the capping layer.
 9. A semiconductorstructure, comprising: a first fin protruding above an isolation region;a gate structure disposed over the first fin; a source/drain region overthe first fin and adjacent the gate structure; an interlayer dielectric(ILD) disposed over the source/drain region; a first spacer along asidewall of the gate structure, the first spacer being interposedbetween the ILD and the gate structure; and an air gap disposed over thefirst spacer, the air gap being laterally interposed between the ILD andthe first spacer, the air gap being vertically interposed between thesource/drain region and the isolation region.
 10. The structure of claim9, wherein the first spacer contacts an upper surface of the first fin,an upper surface of the isolation region, and the sidewall of the gatestructure.
 11. The structure of claim 10 further comprising a secondspacer, the second spacer contacting the upper surface of the isolationregion and a bottom surface of the ILD.
 12. The structure of claim 11,wherein the air gap contacts a lower surface of the source/drain regionand a lower surface of the second spacer, wherein the second spacercontacts an upper surface of the source/drain region.
 13. The structureof claim 12 further comprising an insulating material directlyinterposed between the first spacer and the second spacer, wherein theair gap is bounded by the first spacer, the second spacer, thesource/drain region, and the insulating material.
 14. The structure ofclaim 9, wherein a portion of the air gap is directly interposed betweenthe first spacer and the source/drain region.
 15. A semiconductorstructure, comprising: a shallow trench isolation (STI) regioninterposed between a first fin and a second fin; a first gate structuredisposed over the STI region, the first fin, and the second fin; asecond gate structure disposed over the STI region, the first fin, andthe second fin; a source/drain region disposed over the first fin andthe second fin, the source/drain region being interposed between thefirst gate structure and the second gate structure; a first spacer alonga sidewall of the first gate structure, a sidewall of the second gatestructure, and an upper surface of the STI region; a second spacer alongan upper surface of the source/drain region; and an air gap interposedbetween the first spacer and the second spacer, the air gap exposing alower surface of the second spacer and a lower surface of thesource/drain region.
 16. The structure of claim 15, wherein the air gapextends between the source/drain region and the first gate structure.17. The structure of claim 16, wherein the air gap extends between thesource/drain region and the second gate structure.
 18. The structure ofclaim 15, wherein the first spacer separates the air gap from the STI.19. The structure of claim 15, wherein the air gap has a first widthbetween the first spacer and the second spacer, wherein the air gap hasa second width between the first spacer and the source/drain region,wherein the first width is less than the second width.
 20. The structureof claim 15 further comprising a refill material over the air gap andinterposed between the first spacer and the second spacer, an uppersurface of the refill material being level with an upper surface of thefirst spacer.